LANRUI P08 Explosion-Proof Solder Tin Gasket 20x20mm High Temperature Resistant Soldering Pad for Phone CPU IC Chip Repair

Description

LANRUI P08 Explosion-Proof Solder Tin Gasket 20x20mm High Temperature Resistant Soldering Pad for Phone CPU IC Chip Repair 【Explosion-Proof Tin Protection】Specially designed to prevent tin explosion and solder ball splashing during BGA chip soldering processes with hot air guns. 【Ultra-Clear Glass Coverage】Features high heat resistance ultra-clear glass layer that withstands extreme temperatures and protects the steel mesh underneath. 【Impact-Resistant Design】Durable construction with impact-resistant glass that maintains integrity even under stress while protecting the tin-plated steel mesh. 【Anti-Bulging Steel Mesh】Prevents steel mesh deformation and bulging that commonly causes uneven solder application and tin bursting issues. 【Easy Tin Evaluation】Enables splash-free tinning process, making it easier to assess soldering quality and achieve consistent results. 【Oxidation Prevention】Protects against oxidation spots under pads that typically make solder application difficult during the tinning process. Specifications: Model: P08 Dimensions: 20mm x 20mm x 1mm Material: Tin-Plated Steel Mesh + Ultra-Clear Glass